MB324DJ00TBSN70
vs
MB324DT00TBSN70
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
SIMM, SSIM72
|
SIMM, SSIM72
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
70 ns
|
70 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PSMA-N72
|
R-PSMA-N72
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
EDO DRAM MODULE
|
EDO DRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Terminals |
72
|
72
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4MX32
|
4MX32
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SIMM
|
SIMM
|
| Package Equivalence Code |
SSIM72
|
SSIM72
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Power Supplies |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
2048
|
2048
|
| Seated Height-Max |
25.4 mm
|
25.4 mm
|
| Self Refresh |
NO
|
NO
|
| Standby Current-Max |
0.008 A
|
0.008 A
|
| Supply Current-Max |
0.76 mA
|
0.76 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
3
|
3
|
|
|
|