MB251
vs
GBPC2506
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SEMITRONICS CORP
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.2 V
|
1.1 V
|
| JESD-30 Code |
S-XUFM-D4
|
S-PUFM-D4
|
| Non-rep Pk Forward Current-Max |
400 A
|
300 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
25 A
|
25 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
600 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
18
|
26
|
| Rohs Code |
|
Yes
|
| Breakdown Voltage-Min |
|
600 V
|
| Operating Temperature-Min |
|
-55 °C
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Test Voltage |
|
600 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MB251 with alternatives
Compare GBPC2506 with alternatives