MAX9967ADCCQ
vs
MAX9961ADCCQ+D
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, TQFP-100
|
HTFQFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
25 µA
|
25 µA
|
| Input Offset Voltage-Max |
20000 µV
|
20000 µV
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e3
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5.25 V
|
-5.25 V
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HTFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Response Time-Nom |
2.2 ns
|
2.2 ns
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage Limit-Max |
11.5 V
|
11.5 V
|
| Supply Voltage-Nom (Vsup) |
9.75 V
|
9.75 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX9961ADCCQ+D with alternatives