MAX9963BGCCQ+TD
vs
MAX9964BGCCQ-D
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
HTFQFP,
|
14 X 14 MM, 0.50 MM PITCH, 1 MM HEIGHT, TQFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
25 µA
|
25 µA
|
Input Offset Voltage-Max |
100000 µV
|
100000 µV
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e3
|
e0
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Neg Supply Voltage Limit-Max |
-7 V
|
-7 V
|
Neg Supply Voltage-Nom (Vsup) |
-5.25 V
|
-5.25 V
|
Number of Functions |
4
|
4
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Type |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HTFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
2.2 ns
|
2 ns
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage Limit-Max |
11.5 V
|
11.5 V
|
Supply Voltage-Nom (Vsup) |
9.75 V
|
9.75 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MAX9963BGCCQ+TD with alternatives
Compare MAX9964BGCCQ-D with alternatives