MAX98360AEFB+
vs
HPA00577DGNR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
10-LFCSP-2X2X0.55
|
|
| Pin Count |
10
|
|
| Manufacturer Package Code |
10-LFCSP-2X2X0.55
|
|
| Date Of Intro |
2019-12-06
|
|
| Samacsys Manufacturer |
Analog Devices
|
Texas Instruments
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-30 Code |
S-XQCC-N10
|
S-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3.2 W
|
0.15 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Equivalence Code |
LCC12,.08SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.6 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Ihs Manufacturer |
|
TEXAS INSTRUMENTS INC
|
| Package Description |
|
TSSOP,
|
| Reach Compliance Code |
|
compliant
|
| Technology |
|
CMOS
|
|
|
|
Compare MAX98360AEFB+ with alternatives
Compare HPA00577DGNR with alternatives