MAX98309EWL+
vs
MAX9717DEBL-T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Part Package Code |
9-WLCSP-N/A
|
BGA
|
Pin Count |
9
|
9
|
Manufacturer Package Code |
9-WLCSP-N/A
|
|
Date Of Intro |
2011-07-14
|
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
Length |
0.965 mm
|
1.52 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2.7 W
|
1.4 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA9,3X3,12
|
BGA9,3X3,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.69 mm
|
0.67 mm
|
Supply Current-Max |
1.8 mA
|
8 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.3 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
0.965 mm
|
1.52 mm
|
Base Number Matches |
2
|
3
|
Pbfree Code |
|
No
|
Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
|
VFBGA, BGA9,3X3,20
|
Reach Compliance Code |
|
not_compliant
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Gain |
|
12 dB
|
JESD-609 Code |
|
e0
|
Technology |
|
BICMOS
|
|
|
|
Compare MAX98309EWL+ with alternatives
Compare MAX9717DEBL-T with alternatives