MAX9790BETJ+
vs
TPA122DR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
HVQCCN, LCC32,.2SQ,20
|
SOIC-8
|
| Pin Count |
32
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
21.6 dB
|
6 dB
|
| JESD-30 Code |
S-XQCC-N32
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
2 W
|
0.15 W
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.75 mm
|
| Supply Current-Max |
40 mA
|
3 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Harmonic Distortion |
|
0.1%
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX9790BETJ+ with alternatives
Compare TPA122DR with alternatives