MAX9725CEBC
vs
NE58633BS,157
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NXP SEMICONDUCTORS
Part Package Code
BGA
QFN
Package Description
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
HVQCCN, LCC32,.2SQ,20
Pin Count
12
32
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Bandwidth-Nom
22 kHz
20 kHz
Consumer IC Type
AUDIO AMPLIFIER
CLASS D AUDIO AMPLIFIER
JESD-30 Code
R-PBGA-B12
S-PQCC-N32
JESD-609 Code
e0
e4
Length
2.02 mm
5 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
2
Number of Functions
1
1
Number of Terminals
12
32
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Power-Nom
0.025 W
0.04 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.67 mm
1 mm
Supply Voltage-Max (Vsup)
1.8 V
1.7 V
Supply Voltage-Min (Vsup)
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
BICMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
1.54 mm
5 mm
Base Number Matches
1
1
Gain
25 dB
Package Equivalence Code
LCC32,.2SQ,20
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
11 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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