MAX9725BEBC-T
vs
MAX9725CEBC+
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
1.54 X 2.02 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, UCSP-12
Pin Count
12
12
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.33.00.01
Bandwidth-Nom
22 kHz
22 kHz
Consumer IC Type
AUDIO AMPLIFIER
AUDIO AMPLIFIER
JESD-30 Code
R-PBGA-B12
R-PBGA-B12
JESD-609 Code
e0
Length
2.02 mm
2.02 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
2
Number of Functions
1
1
Number of Terminals
12
12
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
0.025 W
0.025 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA12,3X4,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
0.67 mm
0.67 mm
Supply Current-Max
3.3 mA
Supply Voltage-Max (Vsup)
1.8 V
1.8 V
Supply Voltage-Min (Vsup)
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NOT SPECIFIED
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
1.54 mm
1.54 mm
Base Number Matches
1
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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