MAX9725BEBC+T vs NE58633BS feature comparison

MAX9725BEBC+T Maxim Integrated Products

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NE58633BS NXP Semiconductors

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Yes
Yes Yes
Obsolete Obsolete
MAXIM INTEGRATED PRODUCTS INC NXP SEMICONDUCTORS
BGA QFN
VFBGA, BGA12,3X4,20 HVQCCN, LCC32,.2SQ,20
12 32
compliant unknown
EAR99 EAR99
8542.33.00.01 8542.33.00.01
22 kHz 20 kHz
AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
R-PBGA-B12 S-PQCC-N32
e1 e4
2.02 mm 5 mm
1 1
2 2
1 1
12 32
85 °C 70 °C
-40 °C
0.025 W 0.04 W
PLASTIC/EPOXY PLASTIC/EPOXY
VFBGA HVQCCN
BGA12,3X4,20 LCC32,.2SQ,20
RECTANGULAR SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260 NOT SPECIFIED
Not Qualified Not Qualified
0.67 mm 1 mm
3.3 mA 11 mA
1.8 V 1.7 V
0.9 V 0.9 V
YES YES
BICMOS
INDUSTRIAL COMMERCIAL
TIN SILVER COPPER Nickel/Palladium/Gold (Ni/Pd/Au)
BALL NO LEAD
0.5 mm 0.5 mm
BOTTOM QUAD
30 NOT SPECIFIED
1.54 mm 5 mm
1 1
25 dB

Compare MAX9725BEBC+T with alternatives

Compare NE58633BS with alternatives