MAX9725BEBC+T
vs
NE58633BS
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NXP SEMICONDUCTORS
Part Package Code
BGA
QFN
Package Description
VFBGA, BGA12,3X4,20
HVQCCN, LCC32,.2SQ,20
Pin Count
12
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Bandwidth-Nom
22 kHz
20 kHz
Consumer IC Type
AUDIO AMPLIFIER
CLASS D AUDIO AMPLIFIER
JESD-30 Code
R-PBGA-B12
S-PQCC-N32
JESD-609 Code
e1
e4
Length
2.02 mm
5 mm
Moisture Sensitivity Level
1
1
Number of Channels
2
2
Number of Functions
1
1
Number of Terminals
12
32
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Power-Nom
0.025 W
0.04 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
HVQCCN
Package Equivalence Code
BGA12,3X4,20
LCC32,.2SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.67 mm
1 mm
Supply Current-Max
3.3 mA
11 mA
Supply Voltage-Max (Vsup)
1.8 V
1.7 V
Supply Voltage-Min (Vsup)
0.9 V
0.9 V
Surface Mount
YES
YES
Technology
BICMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
1.54 mm
5 mm
Base Number Matches
1
1
Gain
25 dB
Compare MAX9725BEBC+T with alternatives
Compare NE58633BS with alternatives