MAX9725AEBC
vs
NE58633BS,157
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
QFN
|
| Package Description |
1.54 X 2.02 MM, 0.60 MM HEIGHT, UCSP-12
|
HVQCCN, LCC32,.2SQ,20
|
| Pin Count |
12
|
32
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
22 kHz
|
20 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PBGA-B12
|
S-PQCC-N32
|
| JESD-609 Code |
e0
|
e4
|
| Length |
2.02 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
32
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Power-Nom |
0.025 W
|
0.04 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.67 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
1.8 V
|
1.7 V
|
| Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
1.54 mm
|
5 mm
|
| Base Number Matches |
5
|
1
|
| Gain |
|
25 dB
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Current-Max |
|
11 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX9725AEBC with alternatives
Compare NE58633BS,157 with alternatives