MAX9725AEBC+T vs NE58633BS,157 feature comparison

MAX9725AEBC+T Maxim Integrated Products

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NE58633BS,157 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC NXP SEMICONDUCTORS
Part Package Code BGA QFN
Package Description VFBGA, BGA12,3X4,20 HVQCCN, LCC32,.2SQ,20
Pin Count 12 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Factory Lead Time 4 Weeks
Bandwidth-Nom 22 kHz 20 kHz
Consumer IC Type AUDIO AMPLIFIER CLASS D AUDIO AMPLIFIER
JESD-30 Code R-PBGA-B12 S-PQCC-N32
JESD-609 Code e1 e4
Length 2.02 mm 5 mm
Moisture Sensitivity Level 1 1
Number of Channels 2 2
Number of Functions 1 1
Number of Terminals 12 32
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Power-Nom 0.025 W 0.04 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA HVQCCN
Package Equivalence Code BGA12,3X4,20 LCC32,.2SQ,20
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 1 mm
Supply Current-Max 3.3 mA 11 mA
Supply Voltage-Max (Vsup) 1.8 V 1.7 V
Supply Voltage-Min (Vsup) 0.9 V 0.9 V
Surface Mount YES YES
Technology BICMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form BALL NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.54 mm 5 mm
Base Number Matches 3 1
Gain 25 dB

Compare MAX9725AEBC+T with alternatives

Compare NE58633BS,157 with alternatives