MAX9718FEBL+T
vs
LM4871MM/NOPB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA, BGA9,3X3,20
|
MSOP-8
|
Pin Count |
9
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
3 dB
|
|
JESD-30 Code |
S-PBGA-B9
|
S-PDSO-G8
|
JESD-609 Code |
e1
|
e3
|
Length |
1.52 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.4 W
|
1.5 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TSSOP
|
Package Equivalence Code |
BGA9,3X3,20
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
1.09 mm
|
Supply Current-Max |
7.5 mA
|
10 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
1.52 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MAX9718FEBL+T with alternatives
Compare LM4871MM/NOPB with alternatives