MAX9717DEBL+T
vs
MAX98310EWL+
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Part Package Code |
BGA
|
9-WLCSP-N/A
|
Package Description |
VFBGA, BGA9,3X3,20
|
|
Pin Count |
9
|
9
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
Gain |
12 dB
|
|
JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
JESD-609 Code |
e1
|
|
Length |
1.52 mm
|
0.965 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.4 W
|
2.7 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA9,3X3,20
|
BGA9,3X3,12
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
0.69 mm
|
Supply Current-Max |
8 mA
|
1.8 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.3 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.52 mm
|
0.965 mm
|
Base Number Matches |
2
|
2
|
Manufacturer Package Code |
|
9-WLCSP-N/A
|
Date Of Intro |
|
2011-07-14
|
|
|
|
Compare MAX9717DEBL+T with alternatives
Compare MAX98310EWL+ with alternatives