MAX9713ETJ
vs
MAX9713ETJ+T
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Part Package Code |
QFN
|
32-LFCSP-5X5X0.75
|
Package Description |
5 X 5 MM, 0.80 MM HEIGHT, MO-220WHHD-2, TQFN-32
|
|
Pin Count |
32
|
32
|
Reach Compliance Code |
not_compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.33.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
22.1 dB
|
22.1 dB
|
JESD-30 Code |
S-PQCC-N32
|
S-XQCC-N32
|
JESD-609 Code |
e0
|
e3
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
8 W
|
8 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
17.5 mA
|
17.5 mA
|
Supply Voltage-Max (Vsup) |
25 V
|
25 V
|
Supply Voltage-Min (Vsup) |
10 V
|
10 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
4
|
1
|
Manufacturer Package Code |
|
32-LFCSP-5X5X0.75
|
Date Of Intro |
|
2003-11-28
|
Samacsys Manufacturer |
|
Analog Devices
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX9713ETJ with alternatives
Compare MAX9713ETJ+T with alternatives