MAX9712ETB+T
vs
TPA0211DGNR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
DFN
|
MSOP
|
Package Description |
HVSON, SOLCC10,.11,20
|
GREEN, PLASTIC, MSOP-8
|
Pin Count |
10
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
12.04 dB
|
2.5 dB
|
JESD-30 Code |
S-XDSO-N10
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e4
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.7 W
|
2 W
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HTSSOP
|
Package Equivalence Code |
SOLCC10,.11,20
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
1.1 mm
|
Supply Current-Max |
5.2 mA
|
6 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD SILVER
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Samacsys Manufacturer |
|
Texas Instruments
|
Harmonic Distortion |
|
1%
|
Noise Figure-Nom |
|
93 dB
|
|
|
|
Compare MAX9712ETB+T with alternatives
Compare TPA0211DGNR with alternatives