MAX9709ETN+
vs
MAX9709ETN+TD
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Part Package Code |
56-LFCSP-8X8X0.75
|
56-LFCSP-8X8X0.75
|
Pin Count |
56
|
56
|
Manufacturer Package Code |
56-LFCSP-8X8X0.75
|
56-LFCSP-8X8X0.75
|
Date Of Intro |
2005-10-14
|
2005-10-14
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
36 dB
|
36 dB
|
Harmonic Distortion |
10%
|
10%
|
JESD-30 Code |
S-PQCC-N56
|
S-PQCC-N56
|
JESD-609 Code |
e3
|
e3
|
Length |
8 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
29 W
|
29 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC56,.31SQ,20
|
LCC56,.31SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
33 mA
|
33 mA
|
Supply Voltage-Max (Vsup) |
22 V
|
22 V
|
Supply Voltage-Min (Vsup) |
10 V
|
10 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
3
|
1
|
Ihs Manufacturer |
|
ANALOG DEVICES INC
|
Package Description |
|
8 X 8 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WLLD-5, TQFP-56
|
Reach Compliance Code |
|
compliant
|
|
|
|
Compare MAX9709ETN+ with alternatives
Compare MAX9709ETN+TD with alternatives