MAX9700AEUB
vs
TPA2039D1YFFR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
TSSOP
|
BGA
|
Package Description |
MO-187CBA, MICRO, SOP-10
|
WCSP-9
|
Pin Count |
10
|
9
|
Reach Compliance Code |
unknown
|
compliant
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
6 dB
|
|
JESD-30 Code |
S-PDSO-G10
|
S-XBGA-B9
|
JESD-609 Code |
e0
|
e1
|
Length |
3 mm
|
1.505 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.6 W
|
3.2 W
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.625 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
3 mm
|
1.505 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
Samacsys Manufacturer |
|
Texas Instruments
|
Noise Figure-Nom |
|
95 dB
|
Package Equivalence Code |
|
BGA9,3X3,16
|
Supply Current-Max |
|
2.5 mA
|
|
|
|
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