MAX9627ATC+T
vs
MAX9627ETC+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
12-LFCSP-3X3X0.75
|
|
Package Description |
3 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, MO-220WEED, TQFN-12
|
3 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, MO-220WEED, TQFN-12
|
Pin Count |
12
|
|
Manufacturer Package Code |
12-LFCSP-3X3X0.75
|
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2010-10-15
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Average Bias Current-Max (IIB) |
10 µA
|
10 µA
|
Common-mode Reject Ratio-Nom |
69 dB
|
69 dB
|
Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
JESD-30 Code |
S-XQCC-N12
|
S-XQCC-N12
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Slew Rate-Nom |
6100 V/us
|
6100 V/us
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.33.00.01
|
|
|
|
Compare MAX9627ATC+T with alternatives
Compare MAX9627ETC+ with alternatives