MAX9380EUA
vs
DM9309J/883
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
TSSOP
|
|
Package Description |
MICRO MAX MO-187, PACKAGE-8
|
DIP,
|
Pin Count |
8
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
OPERATES FROM A -3.0V TO -3.8V SUPPLY FORLVECL APPLICATIONS
|
|
Family |
93
|
|
JESD-30 Code |
S-PDSO-G8
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
|
Length |
3 mm
|
19.43 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
2
|
Number of Inputs |
2
|
4
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
DIP
|
Package Equivalence Code |
TSSOP8,.19
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
245
|
|
Power Supply Current-Max (ICC) |
30 mA
|
|
Prop. Delay@Nom-Sup |
0.385 ns
|
|
Propagation Delay (tpd) |
0.316 ns
|
27 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
3.8 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
ECL10K
|
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
7.62 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare MAX9380EUA with alternatives
Compare DM9309J/883 with alternatives