MAX9291GTN/V+
vs
TPA6166A2YFFR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
56-LFCSP-8X8X0.75
|
|
| Pin Count |
56
|
|
| Manufacturer Package Code |
56-LFCSP-8X8X0.75
|
|
| Date Of Intro |
2015-11-14
|
|
| Samacsys Manufacturer |
Analog Devices
|
Texas Instruments
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
S-XQCC-N56
|
S-XBGA-B25
|
| JESD-609 Code |
e3
|
e1
|
| Length |
8 mm
|
2.44 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
56
|
25
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC56,.31SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
0.625 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
8 mm
|
2.44 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Ihs Manufacturer |
|
TEXAS INSTRUMENTS INC
|
| Package Description |
|
ROHS COMPLIANT
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Output Power-Nom |
|
0.03 W
|
|
|
|
Compare MAX9291GTN/V+ with alternatives
Compare TPA6166A2YFFR with alternatives