MAX900BEWP+
vs
MAX9019EKA+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
SOP, SOP20,.4
|
LSSOP, TSSOP8,.1
|
Pin Count |
20
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
15 µA
|
0.002 µA
|
Bias Current-Max (IIB) @25C |
10 µA
|
0.001 µA
|
Input Offset Voltage-Max |
6000 µV
|
10000 µV
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
12.8 mm
|
2.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Neg Supply Voltage Limit-Max |
-6 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
Number of Functions |
4
|
2
|
Number of Terminals |
20
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Equivalence Code |
SOP20,.4
|
TSSOP8,.1
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Response Time-Nom |
10 ns
|
28000 ns
|
Seated Height-Max |
2.65 mm
|
1.45 mm
|
Supply Current-Max |
25 mA
|
0.0028 mA
|
Supply Voltage Limit-Max |
6 V
|
6 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
7.5 mm
|
1.625 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Output Type |
|
PUSH-PULL
|
|
|
|
Compare MAX900BEWP+ with alternatives
Compare MAX9019EKA+ with alternatives