MAX900AEPP+
vs
MAX900BCWP
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP20,.3
|
SOP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
10 µA
|
15 µA
|
| Bias Current-Max (IIB) @25C |
6 µA
|
|
| Input Offset Voltage-Max |
3000 µV
|
6000 µV
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e0
|
| Length |
26.16 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP20,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Response Time-Nom |
10 ns
|
10 ns
|
| Seated Height-Max |
4.572 mm
|
2.65 mm
|
| Supply Current-Max |
25 mA
|
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
|
|
|
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