MAX819MCUA+
vs
MAX808MCPA+
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC
DIP
Package Description
TSSOP, TSSOP8,.19
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Additional Feature
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
CMOS RAM WRITE PROTECTION, BATTERY-BACKUP MODE
Adjustable Threshold
NO
NO
Analog IC - Other Type
VOLTAGE SUPERVISOR/RESET IC
VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code
S-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
3 mm
9.375 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Equivalence Code
TSSOP8,.19
DIP8,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
4.572 mm
Supply Current-Max (Isup)
0.045 mA
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Threshold Voltage-Nom
+4.4V
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3 mm
7.62 mm
Base Number Matches
3
2
Compare MAX819MCUA+ with alternatives
Compare MAX808MCPA+ with alternatives