MAX809MD-G
vs
MAX706TCUA+
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
1.50 MM, PLASTIC, SOT-23, SOP-3
|
PACKAGE-8
|
Pin Count |
3
|
8
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
R-PDSO-G3
|
S-PDSO-G8
|
Length |
2.85 mm
|
3 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
3
|
8
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.35 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.6 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Additional Feature |
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:Y;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TSSOP8,.19
|
Peak Reflow Temperature (Cel) |
|
260
|
Supply Current-Max (Isup) |
|
0.35 mA
|
Technology |
|
CMOS
|
Terminal Finish |
|
MATTE TIN
|
Threshold Voltage-Nom |
|
+3.08V
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX809MD-G with alternatives
Compare MAX706TCUA+ with alternatives