MAX808MEPA+ vs MAX808MCPA+ feature comparison

MAX808MEPA+ Analog Devices Inc

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MAX808MCPA+ Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code End Of Life Active
Part Package Code 8-PDIP-300_MIL DIP
Pin Count 8 8
Manufacturer Package Code 8-PDIP-300_MIL
Date Of Intro 1996-06-01
Additional Feature CMOS RAM WRITE PROTECTION, BATTERY-BACKUP MODE CMOS RAM WRITE PROTECTION, BATTERY-BACKUP MODE
Adjustable Threshold NO NO
Analog IC - Other Type VOLTAGE SUPERVISOR/RESET IC POWER SUPPLY SUPPORT CIRCUIT
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.375 mm 9.375 mm
Moisture Sensitivity Level 1 1
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.572 mm 4.572 mm
Supply Current-Max (Isup) 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup)
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Package Description 0.300 INCH, PLASTIC, DIP-8
Reach Compliance Code unknown

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Compare MAX808MCPA+ with alternatives