MAX808MCPA+
vs
MAX808MCPA
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP8,.3
|
0.300 INCH, PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
CMOS RAM WRITE PROTECTION, BATTERY-BACKUP MODE
|
CMOS RAM WRITE PROTECTION, BATTERY-BACKUP MODE
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e0
|
Length |
9.375 mm
|
9.375 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
4.572 mm
|
Supply Current-Max (Isup) |
0.09 mA
|
0.09 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX808MCPA+ with alternatives
Compare MAX808MCPA with alternatives