MAX77751DEFG+
vs
MAX77751CEFG+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
24-LFCSP-3X3X0.55
|
24-LFCSP-3X3X0.55
|
Package Description |
FC2QFN-24
|
FC2QFN-24
|
Pin Count |
24
|
24
|
Manufacturer Package Code |
24-LFCSP-3X3X0.55
|
24-LFCSP-3X3X0.55
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2020-07-24
|
2020-07-24
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VQCCN
|
VQCCN
|
Package Equivalence Code |
LCC24,.12SQ,16
|
LCC24,.12SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Supply Current-Max (Isup) |
4 mA
|
4 mA
|
Supply Voltage-Max (Vsup) |
13.7 V
|
13.7 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Threshold Voltage-Nom |
+13.7V
|
+13.7V
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX77751DEFG+ with alternatives
Compare MAX77751CEFG+ with alternatives