MAX7322ATE+T
vs
MAX7323ATE+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN, LCC16,.12SQ,20
|
3 X 3 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WEED-2, TQFN-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of I/O Lines |
4
|
4
|
Number of Ports |
8
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
4
|
Number of Bits |
|
8
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
1.71 V
|
Supply Voltage-Nom |
|
3.3 V
|
|
|
|
Compare MAX7322ATE+T with alternatives
Compare MAX7323ATE+ with alternatives