MAX7318AUG
vs
MAX7311AWG+T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP24,.25
Pin Count
24
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
75 MHz
0.4 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e0
Length
7.8 mm
15.4 mm
Moisture Sensitivity Level
1
Number of Bits
16
16
Number of I/O Lines
16
16
Number of Ports
1
2
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP24,.25
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
2.65 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2 V
2 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
4.4 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
4
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