MAX7318AAG+
vs
PCA6416APW,118
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
24-SSOP-5.3_MM
|
TSSOP2
|
Package Description |
5.30 MM, MO-150, SSOP-24
|
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
|
Pin Count |
24
|
24
|
Manufacturer Package Code |
24-SSOP-5.3_MM
|
SOT355-1
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2004-08-17
|
|
Samacsys Manufacturer |
Analog Devices
|
NXP
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e3
|
|
Length |
8.2 mm
|
7.8 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
16
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
1
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SSOP
|
TSSOP
|
Package Equivalence Code |
SSOP24,.3
|
TSSOP24,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.99 mm
|
1.1 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2 V
|
1.65 V
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5.29 mm
|
4.4 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
1
|
Factory Lead Time |
|
16 Weeks
|
Clock Frequency-Max |
|
0.4 MHz
|
|
|
|
Compare MAX7318AAG+ with alternatives
Compare PCA6416APW,118 with alternatives