MAX7316ATE
vs
MIC74BQS
feature comparison
Pbfree Code |
No
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MICREL INC
|
Part Package Code |
QFN
|
SOIC
|
Package Description |
3 X 3 MM, 0.80 MM PITCH, MO-220, TQFN-16
|
QSOP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
not_compliant
|
JESD-30 Code |
R-XQCC-N16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e0
|
Length |
4.89 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of I/O Lines |
8
|
8
|
Number of Ports |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
245
|
240
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
1.73 mm
|
1.75 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2 V
|
2.7 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
3.9 mm
|
3.9116 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
External Data Bus Width |
|
|
Package Equivalence Code |
|
SSOP16,.25
|
Supply Current-Max |
|
0.006 mA
|
|
|
|
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