MAX7314ATG
vs
PCA9555AHF
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD2, TQFN-24
|
4 X 4 MM, 0.75 MM HEIGHT, PLASTIC, MO-220, SOT994-1, HWQFN-24
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-XQCC-N24
|
S-PQCC-N24
|
| JESD-609 Code |
e0
|
e4
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of I/O Lines |
16
|
16
|
| Number of Ports |
1
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
245
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
3.6 V
|
5.5 V
|
| Supply Voltage-Min |
2 V
|
1.65 V
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
4 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
NXP
|
| Clock Frequency-Max |
|
0.4 MHz
|
| External Data Bus Width |
|
|
|
|
|
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