MAX7311AWG
vs
PCA6416APW,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
SOP, SOP24,.4
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Clock Frequency-Max
0.4 MHz
0.4 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
Length
15.4 mm
7.8 mm
Number of Bits
16
16
Number of I/O Lines
16
16
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Equivalence Code
SOP24,.4
TSSOP24,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
1.1 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2 V
1.65 V
Supply Voltage-Nom
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.5 mm
4.4 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
3
1
Part Package Code
TSSOP2
Pin Count
24
Manufacturer Package Code
SOT355-1
Factory Lead Time
16 Weeks
Samacsys Manufacturer
NXP
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
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