MAX708SCUA+T
vs
MAX705C/D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC
DIE
Package Description
TSSOP, TSSOP8,.19
DIE, DIE OR CHIP
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:Y;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
Adjustable Threshold
NO
YES
Analog IC - Other Type
VOLTAGE SUPERVISOR/RESET IC
VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code
S-PDSO-G8
R-XUUC-N8
JESD-609 Code
e3
e0
Length
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
2
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Equivalence Code
TSSOP8,.19
DIE OR CHIP
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Current-Max (Isup)
0.35 mA
0.35 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Threshold Voltage-Nom
+2.93V
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
Base Number Matches
2
2
Temperature Grade
COMMERCIAL
Compare MAX708SCUA+T with alternatives
Compare MAX705C/D with alternatives