MAX66300ETN+
vs
PTN3363BS
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
End Of Life
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
Package Description |
HVQCCN,
|
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT617-3, HVQFN-32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
S-XQCC-N56
|
S-PQCC-N32
|
Length |
8 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
32
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC56,.31SQ,20
|
LCC32,.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
0.8 mm
|
0.85 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
8 mm
|
5 mm
|
Base Number Matches |
2
|
5
|
Additional Feature |
|
SEATED HGT-NOM
|
|
|
|
Compare MAX66300ETN+ with alternatives
Compare PTN3363BS with alternatives