MAX6400BS22-T
vs
MAX6400BS22+T
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
4-WLCSP-N/A
|
Package Description |
BUMP, UCSP-4
|
BUMP, UCSP-4
|
Pin Count |
4
|
4
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
S-PBGA-B4
|
S-PBGA-B4
|
JESD-609 Code |
e0
|
e1
|
Length |
1.1 mm
|
1.1 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA4,2X2,20
|
BGA4,2X2,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
0.67 mm
|
Supply Current-Max (Isup) |
0.00175 mA
|
0.00175 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Threshold Voltage-Nom |
+2.2V
|
+2.2V
|
Width |
1.1 mm
|
1.1 mm
|
Base Number Matches |
2
|
1
|
Manufacturer Package Code |
|
4-WLCSP-N/A
|
Date Of Intro |
|
2001-04-07
|
Samacsys Manufacturer |
|
Analog Devices
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|