MAX5974AETE+
vs
MAX5974CETE+T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
Part Package Code |
QFN
|
16-LFCSP-3X3X0.75
|
Package Description |
HVQCCN, LCC16,.12SQ,20
|
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
|
Additional Feature |
ALSO HAS CONTROL MODE OF IPK
|
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
VOLTAGE-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Nom |
12 V
|
12 V
|
JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
SINGLE
|
SINGLE
|
Switching Frequency-Max |
600 kHz
|
600 kHz
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
4
|
1
|
Manufacturer Package Code |
|
16-LFCSP-3X3X0.75
|
Date Of Intro |
|
2010-07-23
|
Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX5974AETE+ with alternatives
Compare MAX5974CETE+T with alternatives