MAX5898EGK-TD
vs
MAX5898EGK+TD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
QFN
68-LFCSP-10X10X0.85
Package Description
10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68
Pin Count
68
68
Reach Compliance Code
not_compliant
HTS Code
8542.39.00.01
Analog Output Voltage-Max
1.1 V
1.1 V
Analog Output Voltage-Min
-0.5 V
-0.5 V
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
OFFSET BINARY, 2'S COMPLEMENT BINARY
OFFSET BINARY, 2'S COMPLEMENT BINARY
Input Format
PARALLEL, WORD
PARALLEL, WORD
JESD-30 Code
S-XQCC-N68
S-XQCC-N68
JESD-609 Code
e0
e3
Length
10 mm
10 mm
Number of Bits
16
16
Number of Functions
1
1
Number of Terminals
68
68
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC68,.4SQ,20
LCC68,.4SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
0.9 mm
Settling Time-Nom (tstl)
0.011 µs
0.011 µs
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
10 mm
Base Number Matches
1
2
Manufacturer Package Code
68-LFCSP-10X10X0.85
Date Of Intro
2005-08-19
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MAX5898EGK-TD with alternatives
Compare MAX5898EGK+TD with alternatives