MAX5888AEGK+D
vs
MAX5888AEGK+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
QFN
|
68-LFCSP-10X10X0.85
|
| Package Description |
10 X 10 MM, 0.9 MM HEIGHT, ROHS COMPLIANT, MO-220, QFN-68
|
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
1.1 V
|
1.1 V
|
| Analog Output Voltage-Min |
-0.5 V
|
-0.5 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
S-XQCC-N68
|
S-XQCC-N68
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10 mm
|
10 mm
|
| Linearity Error-Max (EL) |
0.008%
|
0.008%
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Settling Time-Nom (tstl) |
0.011 µs
|
0.011 µs
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
3
|
| Manufacturer Package Code |
|
68-LFCSP-10X10X0.85
|
| Date Of Intro |
|
2003-01-03
|
|
|
|
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