MAX5888AEGK+
vs
MAX5887EGK+D
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Part Package Code |
68-LFCSP-10X10X0.85
|
QFN
|
Pin Count |
68
|
68
|
Manufacturer Package Code |
68-LFCSP-10X10X0.85
|
|
Date Of Intro |
2003-01-03
|
|
Analog Output Voltage-Max |
1.1 V
|
1.1 V
|
Analog Output Voltage-Min |
-0.5 V
|
-0.5 V
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
JESD-30 Code |
S-XQCC-N68
|
S-XQCC-N68
|
JESD-609 Code |
e3
|
e3
|
Length |
10 mm
|
10 mm
|
Linearity Error-Max (EL) |
0.008%
|
0.8%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
16
|
14
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC68,.4SQ,20
|
LCC68,.4SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Settling Time-Nom (tstl) |
0.011 µs
|
0.011 µs
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
|
10 X 10 MM, 0.9 MM HEIGHT, MO-220, QFN-68
|
Reach Compliance Code |
|
compliant
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX5888AEGK+ with alternatives
Compare MAX5887EGK+D with alternatives