MAX5732AUTN+
vs
MAX5732AUTN
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56
|
8 X 8 MM, 0.80 MM HEIGHT, MO-220WLLD-5, TQFN-56
|
Pin Count |
56
|
56
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5 V
|
5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-XQCC-N56
|
S-XQCC-N56
|
JESD-609 Code |
e3
|
e0
|
Length |
8 mm
|
8 mm
|
Linearity Error-Max (EL) |
0.0122%
|
0.0122%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC56,.31SQ,20
|
LCC56,.31SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Settling Time-Max |
20 µs
|
20 µs
|
Settling Time-Nom (tstl) |
20 µs
|
20 µs
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MAX5732AUTN+ with alternatives
Compare MAX5732AUTN with alternatives