MAX5525ETC+T
vs
MAX5525ETC-T
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Part Package Code |
12-LFCSP-4X4X0.75
|
QFN
|
Pin Count |
12
|
12
|
Manufacturer Package Code |
12-LFCSP-4X4X0.75
|
|
Date Of Intro |
2004-01-23
|
|
Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
Input Format |
PARALLEL, WORD
|
SERIAL
|
JESD-30 Code |
S-XQCC-N12
|
S-XQCC-N12
|
JESD-609 Code |
e3
|
e0
|
Length |
4 mm
|
4 mm
|
Linearity Error-Max (EL) |
0.3906%
|
0.3906%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
2
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC12,.16SQ,32
|
LCC12,.16SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Settling Time-Nom (tstl) |
12 µs
|
12 µs
|
Supply Current-Max |
0.008 mA
|
0.008 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
|
HVQCCN, LCC12,.16SQ,32
|
Reach Compliance Code |
|
not_compliant
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX5525ETC+T with alternatives
Compare MAX5525ETC-T with alternatives