MAX544BCSA+
vs
MAX5444BCUB+T
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
0.150 INCH, SOIC-8
|
TSSOP, TSSOP10,.19,20
|
Pin Count |
8
|
10
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
3 V
|
2.5 V
|
Analog Output Voltage-Min |
|
-2.5 V
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
OFFSET BINARY
|
OFFSET BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G10
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
3 mm
|
Linearity Error-Max (EL) |
0.0061%
|
0.0061%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
14
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
10
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP8,.25
|
TSSOP10,.19,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.1 mm
|
Settling Time-Nom (tstl) |
1 µs
|
1 µs
|
Supply Current-Max |
1.1 mA
|
0.2 mA
|
Supply Voltage-Nom |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.9 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare MAX544BCSA+ with alternatives
Compare MAX5444BCUB+T with alternatives