MAX526DENG+
vs
MAX526BMYG/883B
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
24-PDIP-300_MIL
|
DIP
|
| Package Description |
DIP-24
|
DIP,
|
| Pin Count |
24
|
24
|
| Manufacturer Package Code |
24-PDIP-300_MIL
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Date Of Intro |
2001-05-16
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| JESD-30 Code |
R-PDIP-T24
|
R-CDIP-T24
|
| JESD-609 Code |
e3
|
e0
|
| Linearity Error-Max (EL) |
0.024%
|
0.0244%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
12
|
12
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Supply Current-Max |
28 mA
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Input Format |
|
PARALLEL, WORD
|
| Negative Supply Voltage-Nom |
|
-5 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.08 mm
|
| Settling Time-Nom (tstl) |
|
3 µs
|
| Supply Voltage-Nom |
|
15 V
|
| Width |
|
7.62 mm
|
|
|
|
Compare MAX526DENG+ with alternatives
Compare MAX526BMYG/883B with alternatives