MAX5222EKA+
vs
DAC43508RTER
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
LSSOP,
|
WQFN-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e4
|
| Length |
2.9 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.3906%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.45 mm
|
0.8 mm
|
| Settling Time-Nom (tstl) |
10 µs
|
10 µs
|
| Supply Voltage-Nom |
3.6 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.625 mm
|
3 mm
|
| Base Number Matches |
6
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Package Equivalence Code |
|
LCC16,.12SQ,20
|
| Supply Current-Max |
|
5 mA
|
|
|
|
Compare MAX5222EKA+ with alternatives
Compare DAC43508RTER with alternatives