MAX4901EBL+T
vs
MAX4901EBL
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA, BGA9,3X3,20
|
|
Pin Count |
9
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPST
|
DPDT
|
JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
JESD-609 Code |
e1
|
e0
|
Length |
1.52 mm
|
|
Moisture Sensitivity Level |
1
|
|
Normal Position |
NO
|
NO
|
Number of Channels |
2
|
|
Number of Functions |
2
|
3
|
Number of Terminals |
9
|
9
|
Off-state Isolation-Nom |
70 dB
|
|
On-state Resistance Match-Nom |
0.01 Ω
|
|
On-state Resistance-Max (Ron) |
1 Ω
|
0.3 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
FBGA
|
Package Equivalence Code |
BGA9,3X3,20
|
BGA9,3X3,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.8 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
100 ns
|
|
Switch-on Time-Max |
100 ns
|
100 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.52 mm
|
|
Base Number Matches |
2
|
4
|
|
|
|
Compare MAX4901EBL+T with alternatives
Compare MAX4901EBL with alternatives