MAX4760EBX-T
vs
MAX4760EBX+T
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
3 X 3 MM, UCSP-36
|
VFBGA, BGA36,6X6,20
|
Pin Count |
36
|
36
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
DPDT
|
DPDT
|
JESD-30 Code |
S-PBGA-B36
|
S-PBGA-B36
|
JESD-609 Code |
e0
|
|
Length |
3.06 mm
|
3.06 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
4
|
2
|
Number of Functions |
4
|
4
|
Number of Terminals |
36
|
36
|
Off-state Isolation-Nom |
100 dB
|
80 dB
|
On-state Resistance Match-Nom |
0.2 Ω
|
0.2 Ω
|
On-state Resistance-Max (Ron) |
3.5 Ω
|
3.5 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA36,6X6,20
|
BGA36,6X6,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
0.67 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
50 ns
|
60 ns
|
Switch-on Time-Max |
140 ns
|
150 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
3.06 mm
|
3.06 mm
|
Base Number Matches |
3
|
3
|
ECCN Code |
|
EAR99
|
|
|
|
Compare MAX4760EBX-T with alternatives
Compare MAX4760EBX+T with alternatives