MAX4760EBX
vs
MAX4760EBX-T
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B36
|
S-PBGA-B36
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
36
|
36
|
| On-state Resistance-Max (Ron) |
4 Ω
|
3.5 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
VFBGA
|
| Package Equivalence Code |
BGA36,6X6,20
|
BGA36,6X6,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Switch-on Time-Max |
140 ns
|
140 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
5
|
3
|
| Part Package Code |
|
BGA
|
| Package Description |
|
3 X 3 MM, UCSP-36
|
| Pin Count |
|
36
|
| Analog IC - Other Type |
|
DPDT
|
| Length |
|
3.06 mm
|
| Number of Channels |
|
4
|
| Off-state Isolation-Nom |
|
100 dB
|
| On-state Resistance Match-Nom |
|
0.2 Ω
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Seated Height-Max |
|
0.67 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Switch-off Time-Max |
|
50 ns
|
| Width |
|
3.06 mm
|
|
|
|
Compare MAX4760EBX with alternatives
Compare MAX4760EBX-T with alternatives