MAX4760EBX
vs
MAX4760EBX+TW
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B36
|
|
JESD-609 Code |
e0
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
|
Number of Terminals |
36
|
|
On-state Resistance-Max (Ron) |
4 Ω
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FBGA
|
|
Package Equivalence Code |
BGA36,6X6,20
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, FINE PITCH
|
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
|
Switch-on Time-Max |
140 ns
|
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
BOTTOM
|
|
Base Number Matches |
5
|
1
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
4 Weeks
|
Analog IC - Other Type |
|
DPDT
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX4760EBX with alternatives
Compare MAX4760EBX+TW with alternatives